As an indispensable important link in the integrated circuit industry chain, the integrated circuit packaging and testing industry is accompanied by the continuous development and changes of integrated circuit chips. In recent years, its position in the entire integrated circuit industry chain has become increasingly prominent. Driven by the "Outline of National Integrated Circuit Industry Development" and the National Integrated Circuit Industry Investment Fund, the integrated circuit packaging and testing industry has demonstrated unprecedented vitality at the level of capital mergers and acquisitions, and its growth rate is much higher than the global average. In particular, the rapid launch of the National Science and Technology Major Project "Very Large Scale Integrated Circuit Manufacturing Equipment and Complete Processes", the technical capabilities and process levels of the packaging and testing industry have been continuously improved, and the advanced packaging technology processes for mid- and high-end products continue to be in line with international standards. The structure is constantly optimized.
　　In the past five years, the strength of domestic enterprises in the packaging and testing industry has continued to increase
　　By the end of 2016, there were 89 domestic integrated circuit packaging and testing enterprises above designated size, of which local enterprises or domestic-funded enterprises accounted for 35%. Domestic-funded enterprises mainly focus on packaging and testing, while foreign-funded enterprises mainly use IDM as their parent company’s packaging and testing products. Among the top ten companies in the world's integrated circuit packaging and testing industry, Changdian Technology entered in 2012 and ranked sixth. In 2016, Changdian Technology's sales were US$2.899 billion, an increase of 12.6% year-on-year, accounting for 14.90% of the total operating income of the world's top ten IC packaging and testing companies, ranking third; Huatian Technology and Tongfu Microelectronics also entered the world's top Top ten companies, ranked seventh and eighth.
　　The scale of IC packaging and testing industry continues to expand. From January to June 2017, the domestic integrated circuit packaging and testing industry's sales were 80.01 billion yuan, an increase of 13.2% year-on-year, reaching the full year of 2012 sales. In 2016, the sales revenue of the domestic integrated circuit packaging and testing industry was 152.32 billion yuan, which was 189.2% of the 80.568 billion yuan in 2012. It is estimated that by 2017, the sales revenue of the domestic IC packaging and testing industry will be double that of 2012.
　　In recent years, the distribution of IC packaging and testing industry has become more reasonable. Domestic packaging and testing companies are mainly concentrated in the Yangtze River Delta, Beijing-Tianjin Bohai Bay, Midwest, and Pearl River Delta, accounting for 56.2%, 14.6%, 12.4%, and 12.4%, respectively; other regions account for 4.4%.
　　Domestic packaging and testing industry has continuously improved its technological innovation capabilities
The four leading companies in domestic integrated circuit packaging, Changdian Technology, Tongfu Microelectronics, Huatian Technology and Jingfang Technology continue to deepen the layout and strengthen R&D efforts in advanced packaging technology, and have made certain progress, representing domestic integrated circuits Advanced technology level of packaging and testing. According to incomplete statistics of the packaging and testing industry, mid-to-high-end advanced packaging accounted for about 32% of domestic integrated circuit products in 2016, and advanced packaging has accounted for 40% of the integrated circuit products of some major domestic packaging and testing companies. %~60% level.
　　Changdian Technology has a global patented micro-small integrated system substrate process technology, which is widely used in multi-chip and SiP integrated QFN, LGA, BGA packages. The key technology is to realize the fan-in and fan-out design capabilities on the panel package. The small size brings the ultra-small and thin package. In terms of micro-miniature integrated system substrate process technology (MIS), 25μm ultra-thin chip stacking process technology, etc., it has reached the international advanced level and has a number of independent intellectual property rights. At the same time, based on Cu Pillar's low-cost, high-density advanced flip-chip packaging technology-fcCuBE, it significantly reduces the high cost due to the close pitch and high I/O in flip-chip packaging.
　　Huatian Technology has made great progress in the research and development of multi-turn V/UQFN, FCQFN and AAQFN packaging process technology. In terms of TSV (SiP) packaging technology, 12-inch image sensor wafer-level packaging and silicon-based microphone substrate packaging have achieved mass production; for fingerprint recognition, TSV through-silicon through-wafer wafer-level packaging solutions and ultra-thin leads have been developed Plastic packaging technology; FCBGA packaging technology of domestic CPU has been mass produced successfully; FC+WB technology, PA packaging technology has entered the stage of mass production.
　　Tongfu Microelectronics has made good progress in advanced packaging, such as BGA, FC-CSP (Copper Pillar), WLP, SiP, etc. Successful mass production in the 12-inch 28nm advanced packaging and testing process. On the Copper Clip product, a multi-chip package is realized. A single product contains up to 4 clips, no bonding wire bonding, and mass production is achieved through customer reliability verification.
　　Suzhou Jingfang focuses on the field of advanced packaging and insists on independent research and development. Its CIS wafer-level advanced packaging, fingerprint identification chip wafer-level advanced packaging and MEMS wafer-level advanced packaging have reached the international advanced level. It will further invest in the development of next-generation advanced packaging processes for new fields such as virtual reality, intelligent manufacturing and automotive electronics.
　　The major scientific and technological projects in the packaging and testing sector have achieved remarkable results
According to preliminary statistics, the National Science and Technology Major Project "Very Large-Scale Integrated Circuit Manufacturing Equipment and Complete Processes" has been actively promoted by the strategic alliance of integrated circuit packaging and testing industry chain technology innovation, and it has achieved the advantage of "Big Corps Operation" by the end of 2016. The sales of major special projects amounted to 10.447 billion yuan, 2622 patents were applied for and 1,240 were authorized.
　　With the promotion of major national science and technology projects, the advanced packaging technology of integrated circuits has made great progress. International advanced TSV-CIS, Wafer Bumping, FBGA, FC-BGA, WLCSP, FBGA, MEMS, RF-SiP and other advanced packaging technologies have been successfully developed or mass-produced. Changdian Technology, Huatian Technology, Tongfu Microelectronics and other companies have made new breakthroughs in the fields of "3D-MIS packaging technology", "multi-turn FCQFN packaging technology" and "FCCSP packaging technology products". Suzhou Jingfang took the lead in building the world's first 12-inch CIS TSV wafer-level packaging mass production line. The development and industrialization of high-density packaging technology, high-power device packaging technology, packaging system integration technology corresponding to high-end 40nm/28nm and other technology nodes have shown initial results; the scale and proportion of high-end packaging have further increased, and they have cooperated with domestic and some foreign IC design companies. The comprehensive supporting capabilities (design, development, packaging, testing, etc.); the new independent intellectual property packaging technology has received international mainstream recognition and began to enter mass production.
　　With the support of major national science and technology projects, the R&D level of domestic enterprises has been continuously improved. "High-end packaging technology and high-capacity flash memory integrated packaging technology development and industrialization" and other projects successfully passed the acceptance of the special organization, and successfully won the continuous growth of domestic and foreign high-end customers orders. Packaging and testing equipment and material application engineering projects and packaging and testing process, equipment and material development and industrialization projects have been smoothly launched, such as leadless, fine pitch, multi-chip, stacked, chip-level, system-level, wafer-level, silicon through-hole The research and development of a series of advanced packaging technologies, the cooperation between the industry chain, production, research, and research have been further strengthened, and the innovation system, innovation strength, and innovation effect have been greatly improved, which has promoted the healthy development of China's integrated circuit packaging and testing industry chain.
What is even more gratifying is that the Huajin Semiconductor Packaging Pioneer was established by the joint investment of 9 units including the Institute of Microelectronics of the Chinese Academy of Sciences and the leading enterprise of the packaging and testing industry, Changdian Technology, Tongfu Microelectronics, Huatian Technology, Shennan Circuit, and Suzhou Jingfang. The technology research and development center conducts system-level packaging/integration pilot technology research through a new model of industry-university-research and application that focuses on enterprises. The research fields include 2.5D/3D through-silicon via (TSV) interconnection and integration of key technologies, wafer level Verification, improvement and development of high-density packaging technology, SiP product applications, and materials and equipment related to packaging technology. At present, a complete 12-inch (8-inch compatible) mid-process production and processing platform and micro-assembly platform have been built, with two engineering R&D centers and three public technical service platforms, with 12-inch wafer TSV manufacturing technical capabilities and detail distance Micro-bump manufacturing capabilities and advanced packaging micro-assembly capabilities, as well as chip front-end testing and reliability analysis capabilities, as well as advanced packaging design simulation capabilities. It can not only provide enterprises with packaged technology development, technology transfer, process processing and other services, but also provide a public service research and development platform for the industry to carry out common technical research. Chinese enterprises have owned 585 domestic (international) patents, provided hundreds of technical services for more than 100 enterprises, developed a number of products with industrialization prospects, and derived and incubated many enterprises.
　　Industry fund participation further expands and strengthens the packaging and testing industry
With the gradual implementation of the "Outline for the Advancement of the National Integrated Circuit Industry" and the launch of the National Integrated Circuit Industry Investment Fund project, domestic leading enterprises have successively started expansion, acquisition, and restructuring, which has driven the integration of the entire integrated circuit industry. Enterprises have also accelerated the process of internationalization. For example, Changdian Technology acquired Xingke Jinpeng, Tongfu Microelectronics acquired AMD packaging and testing plant, and Huatian Technology acquired US FCI, etc., which greatly strengthened the technical strength of domestic enterprises.
SMIC has become the largest single legal person shareholder of Changdian Technology, striving towards a virtual IDM factory, attracting IC design industry's attention, especially Qualcomm has invested in SMIC Changdian, and MediaTek has also actively cooperated with Changdian Technology and Tongfu Microelectronics, highlighting The new strategy of alliance between foundry and packaging and testing plants has gradually integrated into a new force. SMIC Changdian Co., Ltd., built in cooperation with SMIC, has 12-inch bump processing and supporting wafer chip testing capabilities. It has successfully implemented a 12-inch bump package, which is closer to China, the world's largest mobile terminal. The market, thereby helping chip design companies significantly shorten the market response time and better serve the rapidly changing mobile terminal market. Tongfu Microelectronics, Huahong Hongli and Shanghai Huali are conducting strategies in mid-segment process technology such as chip design, 8/12-inch chip manufacturing, bump manufacturing, micro bump testing, and advanced packaging and testing technologies such as FC/TSV/SiP Cooperation, cooperative development of related technologies, realization of the whole industrial chain, complementation of advantages, sharing of resources, and the formation of a strategic alliance for win-win cooperation.
　　In addition, Changdian Technology is also investing and expanding production in Suqian, Chuzhou, Anhui, and other places, Huatian Technology has implemented industrial expansion in Xi'an, Kunshan and other places, and Tongfu Microelectronics has implemented investment expansion in Hefei and Xiamen.
　　 Collaborative innovation is the key to the next development of packaging and testing industry
　　 From the perspective of the development direction of the post-Moore era, the development of packaging and testing technology will definitely bring unprecedented opportunities for industrial development. All-round collaborative innovation of the industrial chain will be one of the important ways to promote the further development of my country's integrated circuit packaging and testing industry.
　　Universal technology R&D platform—Huajin Semiconductor is a beneficial exploration of the innovative collaborative model of enterprises in the post-Moore era. The Huajin model has well solved the contradiction between competition and cooperation between enterprises, made full use of the advantageous resources between enterprises, and solved the problems of intellectual property rights in the R&D process. The R&D platform has played a very important role in improving the overall technical level of the industry. Good promotion.
　　 Synergy between wafer and packaging-SMIC. With the birth of "Zhongdao", the cooperation between packaging and testing companies and wafer manufacturing companies has become a new collaborative model. Changdian Technology and SMIC established an industrial chain with 12-inch bump processing and supporting testing capabilities, using a pure foundry model, focusing on the development and manufacturing of advanced processes in the middle of the semiconductor; Huatian Technology and Wuhan Xinxin, Tongfu Microelectronics Intensive cooperation has been carried out with Huali Electronics.
　　 Collaborative design, which is an innovative design and packaging model based on product development. Nowadays, as chip functions and power management become more and more complicated, the structure of the package becomes more and more complicated. The traditional IC-package-PCB design sequence is no longer suitable for today's products. The integrated collaborative design between IC-package-PCB has become inevitable.
　　 Consortium collaboration, which is based on the collaborative innovation model of the packaging and testing industry chain. It should mainly consist of end users, design companies, chip companies, packaging and testing companies, and material and equipment suppliers, etc., to form a complete integrated circuit industry chain, cooperate with the industry chain's superior technology, talents and resources to solve key technologies, large-scale equipment, core materials The lack of funds, talents, technology and equipment in the early stages of R&D ultimately meets the industrial needs of end users.